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LED Heat Sink With Fan (Cooling Module) Liquid Cooling Plate
Datos del producto:
| Lugar de origen: | Dongguan, Guangdong, China |
| Nombre de la marca: | UCHI |
| Certificación: | UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL |
Pago y Envío Términos:
| Cantidad de orden mínima: | 1000 Uds. |
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| Precio: | Negociable |
| Detalles de empaquetado: | a granel |
| Tiempo de entrega: | 5-7 días |
| Condiciones de pago: | T/T, Paypal, Western Union, gramo del dinero |
| Capacidad de la fuente: | 5000,000,000PCS por mes |
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Información detallada |
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| Tratamiento de superficie de enfriamiento: | anodizado sin colorearCalor | Material del cuerpo: | Aluminio |
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| Poder de disipación de calor: | ≥ 100W | Artículo ningún: | Placa de refrigeración líquida 14 |
| Conductividad térmica: | Cobre: ~400 W/m·K, Aluminio: ~205 W/m·K | Dimensión del producto: | se puede personalizar |
| Embalaje: | Bolsa de PE Cartón | Tolerancia: | 0.01-0.05 mm |
| Resistencia a la corrosión: | Alto, con revestimiento protector. | Cojinete: | Rodamiento de aleación |
| Poder de disipación térmica: | 2000W | ||
| Resaltar: | LED heat sink cooling module,liquid cooling plate with fan,cooling module with LED heat sink |
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Descripción de producto
LED Heat Sink with Fan (Cooling Module)
Product parameters of LED Heat sink with Fan
Material: Al 1100
Size:9.3*7.5*25.5cm mm
Weight: 0.614kg
Technology: Stamping
Feature: Higher cooling ability and good conductivity
Surface treatment: Oil-cleaning passivation
Heat cooling power: 300W
Product advantage of LED Heat sink with Fan
Every electrical and electronic component in a circuit generates some amount of heat while the circuit is executed by providing power supply. Typically high-power semiconducting devices like power transistors and the opto electronics such as light emitting diodes,lasers generate heat in considerable amounts and these components are inadequate to dissipate heat, as their dissipation capability is significantly low.
Due to this, heating up of the components leads to premature failure and may cause failure of the entire circuit or system’s performance. So, to conquer these negative aspects, heat sinks must be provided for cooling purpose.
I. Structural Composition
- Heat sink body: Aluminum extrusion/finned heat sink with anodized surface to expand heat dissipation area
- Cooling fan: DC silent fan (12V/24V), exhausting air outward or blowing air inward for forced convection
- Thermal interface layer: Thermal grease/thermal pad, connecting LED chips and aluminum PCB
- Mounting accessories: Screws and buckles, compatible with flood lights, high‑bay lights, stage lights and grow lights
II. Core Features
- Active cooling with fast temperature reduction and low thermal resistance; supports high‑power LEDs from 50W to over 300W
- Compared with pure aluminum heat sinks, it features smaller size, longer chip service life and less light attenuation under the same power
- Temperature‑controlled models support automatic start/stop or speed regulation according to temperature, with lower noise and power consumption
- Drawbacks: Fan noise, power supply required, and dust‑proof maintenance needed for long‑term use
III. Common Application Scenarios
IV. Selection Guidelines
- Power matching: Specifications of heat sink and fan shall be no less than the actual power of the LED
- Voltage: Fans commonly use 12V or 24V, matching the LED driver voltage
- Noise: Choose silent fans for household/indoor use, and high‑air‑volume fans for industrial use
- Protection level: Select waterproof fans and waterproof aluminum housings for outdoor applications
