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Gold-Plated Miniature Liquid Cooling Low-Thermal-Resistance Applications.
Datos del producto:
| Lugar de origen: | Dongguan, Guangdong, China |
| Nombre de la marca: | Uchi |
| Certificación: | SMC |
| Número de modelo: | Disipador de calor |
Pago y Envío Términos:
| Cantidad de orden mínima: | 100 piezas |
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| Precio: | 1300-1500 dollars |
| Tiempo de entrega: | No limitado |
| Condiciones de pago: | T/T, Paypal, Western Union, MoneyGram |
| Capacidad de la fuente: | 50000000 unidades por mes |
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Información detallada |
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| Líquido: | Agua o refrigerante adecuado | Ruido: | 17dB |
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| Superficie: | Anodizado y pulido | Acabado superficial: | Niquelado o anodizado |
| Ancho: | De acuerdo con la demanda del cliente | Proceso profundo: | mecanizado cnc |
| Peso del producto: | 0,78 kilos | peso: | Aproximadamente 200 gramos |
| Peso bruto único: | 1.000 kg | Presión de trabajo: | Al menos 1 barra |
| Interfaz de alimentación: | 3 pines | Tamaño de la instalación: | 10 * 20 |
| Resaltar: | gold-plated liquid cooling plate,miniature low-thermal-resistance cooling,liquid cooling plate with warranty |
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Descripción de producto
Gold-Plated Miniature Liquid Cooling Plate
Gold-plated miniature liquid cooling plates are micro liquid cooling heat dissipation components designed for high-precision, high-reliability, and low-thermal-resistance applications. They typically feature centimeter-scale dimensions and millimeter-level thickness. Their core structure consists of a copper, aluminum, or molybdenum-copper base with a gold-plated surface, achieving ultra-low interface thermal resistance, corrosion resistance, oxidation resistance, as well as solderability and bondability.
I. Core Features (Matching your requirements: strong heat dissipation, no leakage, long service life)
1. Strong Heat Dissipation (Ultra-low Resistance, Micro-channels)
- Base material: mostly oxygen-free high-conductivity copper (OFHC Cu) or molybdenum-copper (MoCu), with thermal conductivity of 380~401 W/m·K.
- Flow channels: micro-channels, pin fins, or etched channels (50~200μm in width), with thermal resistance as low as 0.01~0.05℃·cm²/W.
- Gold-plated interface: gold (~317 W/m·K) is non-oxidizing with extremely low contact thermal resistance, superior to nickel or tin coatings.
- Ultra-thin profile: thickness 1~5mm, providing an extremely short heat transfer path from heat source to coolant.
2. No Leakage (Miniature High-Reliability Sealing)
- Processes: vacuum brazing, diffusion bonding, laser welding (adhesives and sealing rings free).
- Pressure resistance: 3~10 bar, helium leak rate ≤1×10⁻⁸ Pa·m³/s.
- Small size: 20×20mm ~ 80×80mm, suitable for chips, lasers, and RF devices.
3. Long Service Life (Corrosion Resistance, Anti-aging, High Durability)
- Gold plating thickness: 0.1~2μm (commonly 0.5~1μm).
- Chemical inertness: water resistant, salt spray resistant, non-oxidizing, free from galvanic corrosion.
- Diffusion barrier: typically a 3~5μm nickel underlayer to prevent copper migration.
- Temperature range: -55℃~150℃, stable under thermal cycling.
- Service life: meets military / aerospace / optical module standards (10~20 years).
II. Real Functions of Gold Plating (Not for Decoration)
- Reduce interface thermal resistance: direct contact with chips / heat sinks, no oxide layer, stable thermal resistance.
- Anti-corrosion: no rust, scaling, or electrical leakage in coolant or air environments.
- Solderable & bondable: compatible with soldering, AuSn soldering, and ultrasonic bonding (semiconductor / optical communications).
- Anti-galvanic corrosion: stable potential between copper and gold in liquid cooling systems, avoiding electrochemical corrosion.
- High reliability: zero-failure requirements for military, aerospace, and medical applications.
III. Main Structures and Processes
Micro-channel Etched Type (Most Common)
Copper etching → cover plate brazing → overall gold plating.
Applications: lasers, optical modules, AI chips, FPGAs, high-power ICs.
Tube-embedded Miniature Type
Thin copper tubes (φ1~3mm) press-fitted / brazed → surface gold plating.
Applications: medical instruments, high-precision sensors, small lasers.
Gold-Plated MoCu / WCu Type
Low thermal expansion, high thermal conductivity, with nickel + gold plating barrier layer.
Applications: military, aerospace, high-power microwaves, VCSEL / pump sources.
IV. Typical Application Scenarios
- Optical communications: TOSA/ROSA, EDFA, high-speed optical modules, laser diodes.
- Semiconductors: high-end CPU/GPU/ASIC, SiC/GaN power chips, probe stations.
- Military / Aerospace: missile-borne computers, radar T/R components, satellite electronics.
- Medical treatment: precision instruments, laser therapy, superconducting / cryogenic probes.
- High-end industrial control: high-precision servos, LiDAR, quantum computing chips.
V. Key Parameters (Industry Standard)
- Dimensions: 20×20 ~ 80×80mm, thickness 1~5mm.
- Materials: OFHC copper (C1100/C1020), molybdenum-copper (MoCu).
- Plating: Ni 3~5μm + Au 0.5~1μm (hard gold / soft gold).
- Flow resistance: 0.5~2 bar @ 0.5~2 L/min.
- Thermal resistance: 0.02~0.08℃·cm²/W (@25℃ water).
- Working pressure: ≥6 bar, bursting pressure ≥12 bar.
- Leak detection: helium leak rate ≤1×10⁻⁸ Pa·m³/s.
VI. One-Sentence Summary
Gold-plated miniature liquid cooling plate = miniaturization + micro-channels + high-thermal-conductivity base + gold-plated surface. Through ultra-precision manufacturing, it achieves ultra-low interface thermal resistance, zero leakage, long service life, and corrosion resistance, making it a “gold-standard” cooling solution for high-end precision electronics, lasers, and optical modules.
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